PCB thermal dissipation is vital, 10 principles must be followed

　　For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, and the component will fail due to overheating. The reliability of the electronic equipment Performance will decrease. Therefore, it is very important to conduct a good thermal dissipation treatment on the circuit board. The thermal dissipation of the PCB circuit board is a very important link, so what is the thermal dissipation technique of the PCB circuit board, let's discuss it together below.

　　1. Thermal dissipation through the PCB board itself

　　PCB board has excellent electrical properties and processing properties, but poor thermal dissipation. It is almost impossible to expect heat to be conducted by the resin of the PCB itself, but to dissipate heat from the surface of the component to the surrounding air.

　　2. Using radiator, heat conduction plate

　　This is the most common way. A radiator or heat pipe can be added to the high heat components. When the temperature cannot be lowered, a radiator with a fan can be used to enhance the thermal dissipation effect. Usually, a soft thermal phase change thermal pad is added on the surface of the component to improve the thermal dissipation effect.

　　3. Free convection air cooling

　　If this kind of thermal dissipation method is adopted, it’s better to arrange the integrated circuits (or other components) in a vertical manner or in a horizontal manner.

　　4. Adopt reasonable wiring design to realize thermal dissipation

　　This method relies heavily on the design ability of the engineer. The resin in the plate has poor thermal conductivity, and the copper foil lines and holes are good conductors of thermal. Therefore, increasing the copper foil area and increasing the thermally conductive holes are the main means of thermal dissipation.

　　5. Layout the thermal source according to the air flow direction

　　The components on the same printed board should be arranged as far as possible according to their calorific value and degree of thermal dissipation. The components with small calorific value or poor heat resistance should be placed on the uppermost flow (entry) of the cooling airflow, and those components with calorific value or good heat resistance should be placed at the most downstream of the cooling airflow.

　　6. Considering the impact of high-power components on the surroundings

　　In the horizontal direction, the high-power components are arranged as close to the edge of the printed board as possible; in the vertical direction, the high-power components are arranged as close as possible to the top of the printed board, which can reduce the influence of these components on the temperature of other components during operation.

　　7. Study the air flow path

　　The thermal dissipation of the printed board in the equipment mainly relies on air flow, and the air flow always tends to flow in places with low resistance. Therefore, when configuring components on the printed circuit board, avoid leaving a large airspace in a certain area. The configuration of multiple printed circuit boards in the whole machine should also pay attention to the same problem.

　　8. Appropriate placement of temperature-sensitive components

　　This type of component is best placed in the lowest temperature area (such as the bottom of the component). Never place it directly above the heating component. It is best to stagger multiple components on the horizontal plane.

　　9. The component layout with the largest heat generation

　　The components that generate the most thermal are arranged near the best position for thermal dissipation. Do not place high-heating components on the corners and peripheral edges of the printed board, unless a heat sink is arranged near it.

　　10. Avoid gathering of hot spots

　　Distribute the power evenly on the PCB board as much as possible to keep the PCB surface temperature performance uniform and consistent.

　　Lithium-ion battery (LIB) has become the main energy storage solution in modern social life. Among them, lithium iron phosphate batteries are a perfect substitute for lead-acid batteries, and are the first choice for grid-connected peak shaving, off-grid energy storage, photovoltaic energy storage, UPS, data center and other industries.